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نشانی و اطلاعات تماس
تگ TSVs
جزئیات خدمات ترجمه در ترجمه تخصصی
Improving 3D-Floorplanning Using Smart Selection
1026 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 4, NO. 6, JUNE 2014
Chapter 4. Energy and Area E�cient TSV Signaling for 3D-IC NoCs
This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI 10.1109/TC.2016.2532871, IEEE
are great candidates for large NoCs especially when these between the advantages and disadvantages of vertical in-
8� 8� 2 = 128. Also, the total number of TSVs,jTj, is equal
80
Fig. 11: Performance under shuffle traffic for 5 TSVs
Fig. 18: Performance under table-based traffic with five TSVs
